ITC News and Highlights

• Endevco airborne amplifiers serve flight testing

  January 6, 2010
  Endevco airborne amplifiers team with piezoelectric microphones and accelerometers for use in flight-test applications to offer a microcircuit with low power consumption.  More

• ITC 2009: OptimalTest deepens test management offerings

  Ron Wilson, EDN Executive Editor, November 6, 2009
  OptimalTest announced three significant extensions to the company's suite of tester-monitoring and data analysis tools.  More

• ITC 2009 panel explores future of analog test

  Ron Wilson, EDN Executive Editor, November 6, 2009
  Panelists from both the semiconductor and EDA industries discuss whether there is any way for the EDA industry to help accelerate the testing of analog and mixed-signal circuits.  More

• ITC 2009: BIST to give way to built-in self-everything as 3-D chips emerge

  Rick Nelson, Editor in Chief, October 8, 2009
  Are fundamental changes needed in test? That's a question sure to stir controversy at the 40th International Test Conference, scheduled for November 3-5 in Austin, TX.  More

• 3-D chips, outreach to designers among highlights planned for 2009 International Test Conference

  Rick Nelson, Editor in Chief, September 17, 2009
  Boundary scan, testing of 3-D chips, yield vs. quality, and outreach to the design community will be among items on the agenda at the 40th International Test Conference, scheduled for November.  More

• ITC 2008: Asset joins in-Sync program, touts remote JTAG controller

  November 3, 2008
  Asset InterTech said it has joined Synopsys's in-Sync program for third-party suppliers of EDA-related products. The company also highlighted its Remote Instrumentation Controller (RIC) family.  More

• ITC 2008: Cadence assists Hitachi with 300X compression, Moai with fast tapeout

  November 3, 2008
  Cadence said Hitachi has combined Encounter Test pattern-fault modeling with test pattern generation, compression, and diagnostics to produce LSI devices for telecommunications and other applications. Cadence also said that Moai Electronics has deployed Cadence Encounter RTL Compiler and Encounter Test to tape out a flash memory controller.  More

• ITC 2008: JTAG Technologies, Teseda tout Teradyne initiatives

  November 3, 2008
  Representatives of JTAG Technologies and Teseda were on hand at the International Test Conference to describe separate initiatives in conjunction with Teradyne—involving TestStation boundary-scan integration and silicon debug, respectively.  More

• ITC 2008: OptimalTest to provide test-management software to STATS ChipPAC

  November 3, 2008
  OptimalTest said that it has signed an agreement with STATS ChipPAC to provide OptimalTest’s Station Controller software as a test-management tool. The first implementation of OptimalTest’s Test Floor Operations software will be in STATS ChipPAC’s operation in South Korea.  More

• ITC 2008: Goepel debuts I/O module, details new initiative with SPEA

  November 3, 2008
  At the International Test Conference, Goepel electronic introduced the SFX-9305 I/O module as new addition to the ScanFlex hardware platform. It also announced extended JTAG functionality for the SPEA 4040 flying prober.  More

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