Tech Trends

• Readers speak out about their favorite instruments

  Martin Rowe, Senior Technical Editor, January 23, 2012
  Ask any musician about his or her favorite instrument, and you’ll get a mix of old and new, but mostly old. The same goes for engineers. Several engineers voiced their opinions about their favorite test instruments on my “Rowe’s and Columns” blo.  More

• Measurements keep pumpkins sailing

  Martin Rowe, Senior Technical Editor, December 15, 2011
  On Thanksgiving Day, the chances are pretty good that you watched football on television. But there was another televised competition you could have watched instead: Punkin Chunkin on The Discovery Channel.  More

• IC tools show integration progress

  Ron Wilson, Contributing Technical Editor, November 1, 2011
  Presentations at the 2011 International Test Conference illustrated the growing level of integration within the respective product lines of Mentor Graphics and Synopsys. This evolution is partly a result of initiatives within the two EDA firms to build bridges between design intent, physical analysis, test generation, and yield management.  More

• European AOI/AXI vision sales in US rise

  Ann R. Thryft, Contributing Technical Editor, November 1, 2011
  Manufacturers of automated optical inspection and automated x-ray inspection systems, such as Viscom, Goepel Electronics, and Vi Technology, are experiencing increased sales in North America  More

• IPv6 stresses network testing

  Martin Rowe, Senior Technical Editor, October 1, 2011
  Although IPv6 has been in development for years, it is now moving into deployment. With that deployment comes the need for vendors to test equipment and networks that operate with the new protocol and also maintain IPv4 compatibility.  More

• Software key to effective use of ATE hardware

  Rick Nelson, Editorial Director, September 1, 2011
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• Plasma FIB speeds failure analysis

  Ann R. Thryft, Contributing Technical Editor, September 1, 2011
  A new focused ion beam source technology, ICP (inductively coupled plasma) using a xenon ion beam, can remove material faster than other FIB technologies.  More

• Engineers know when to automate

  Martin Rowe, Senior Technical Editor, August 1, 2011
  The decision to automate product testing often involves more than monetary costs. Indeed, you can start the decision-making process by calculating the time that automating a test can save.  More

• IC package inspection gets complicated

  Ann R. Thryft, Contributing Technical Editor, July 1, 2011
  Integrated device manufacturers and their subcontractors must inspect a wider range of package sizes and thicknesses, perform more substrate inspection for some package types, boost inspection accuracy, and increase the amount and accuracy of metrology.  More

• EDA and test companies team up on LTE

  Rick Nelson, Editorial Direcor, July 1, 2011
  LTE is gaining considerable attention from design and test firms, with the most recent news coming from Rohde & Schwarz and Synopsys, which have announced a collaborative effort to accelerate the design and verification of LTE and LTE-Advanced wireless systems.  More

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