Tektronix, MOSIS ink ASIC services agreement

Test & Measurement World Staff- August 18, 2012

Tektronix Component Solutions, a custom microelectronics services provider, has teamed with supply-chain aggregator MOSIS to help customers develop complete, high-performance ASIC solutions, while reducing the cost of early-stage ASIC development. Through the use of multiple-project wafer runs for device prototyping and package development early in the design cycle, customers can cost-effectively improve the time to first packaged ASIC.

For aerospace and defense contractors, medical OEMs, high-speed communications developers, and others who require top-performing ASICs, this relationship is especially relevant since both Tektronix Component Solutions and MOSIS are experienced working with a variety of high-performance semiconductor technologies. In particular, the organizations have proven expertise in developing high-speed ASICs on SiGe processes. For aerospace and defense customers, the relationship offers a trusted supply chain since both Tektronix Component Solutions and MOSIS are accredited Trusted Suppliers, offering ASIC development and microelectronics assembly in a secure environment.

Tektronix Component Solutions, http://component-solutions.tek.com