4th-generation system offers flexible wafer inspection

Staff - December 13, 2012

Although designed for defect inspection and 2-D metrology of LED wafers, the ICOS WI-2280 from KLA-Tencor can also be used for the inspection of MEMS and semiconductor wafers spanning 2 in. to 8 in. in diameter. The 4th-generation system builds on the WI-22xx platform to deliver increased throughput for reduced cost of ownership.

The patterned-wafer inspection tool offers optical modes with dedicated image processing to enable a high defect-capture rate and recipe robustness against varying process backgrounds. It also uses rule-based binning for defect classification and a recipe-qualification engine for fast yield learning during production ramps. The ICOS WI-2280 accommodates multiple media with minimal equipment changeover time, including the handling of whole wafers in carriers and diced wafers in hoop-ring or film-frame carriers.

More information: www.kla-tencor.com/wafer-inspection/icos-wi-2280.html

KLA-Tencor, www.kla-tencor.com

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