T&MW's Design, Test & Yield News

October 7, 2008

Power-aware test hot at ITC, as is analog test
Power-aware test will be the focus of a panel discussion and two technical paper sessions at this year's International Test Conference, says program chair Nur Touba. Other hot topics include analog test, which will be addressed in an interactive talk with analog legend Bob Pease. Read More

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Aries' RF Sockets Accept Device Pitches Down to 0.40 mm

Aries' line of RF center probe test sockets are compatible with devices requiring pitches as low as 0.40 mm and are ideal for applications including CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash devices with speeds from 1 GHz to more than 10 GHz. The sockets provide minimal signal loss with a signal path of 1.92 mm (0.077").
www.arieselec.com/
arieselec.com/news/2007_04.htm

Boundary-scan software platform automates complex cluster tests per IEEE 1445
The newly developed tools are based on IEEE 1445 DTIF (Digital Test Interchange Format) and enable the application of functional tests for boards and systems with an integrated boundary-scan architecture. Read More

Time to break away from "big iron"?
John VanNewkirk of Checksum argues that it's time for companies to start looking at lower-cost options for in-circuit test. Read More

Digital signal compression in mixed-signal ATE
Signal compression is an appealing technique to use in mixed-signal ATE (automated test equipment) systems because it can reduce the cost of test while improving tester performance. Unfortunately, mixed-signal ATE systems are one of the last remaining class of systems where designers still cling to the comfort of uncompressed, fixed-rate linear coding. Read More

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EDN announces 19th Annual Innovation Awards

EDN proudly announces its 19th Annual Innovation Awards program. Nominate your company's engineers and products today for recognition in this prestigious program. The deadline is November 26, 2008, so don't delay.

Go the Innovation Awards page for more information

Playing it cool
The semiconductor industry has long relied on scan ATPG tools instead of functional test to create stimulus-response patterns with very high fault coverage. But the higher-than-normal power consumption of ATPG can cause device damage or false failures. Read More

Autotestcon sees JTAG diagnostics, RF test, ATEasy release, PXI chassis
Many companies made important announcements at Autotestcon 2008: Intellitech announced a JTAG production-test accelerator, Geotest debuted ATEasy 7.0, Phase Matrix unveiled 26.5-GHz PXI downconverters, Adlink introduced a PXI chassis, Huntron commercialized a near-field RF test system, and more. Read More


Vote for the 2009 Test Engineer of the Year
The six finalists work at St. Jude Medical, Ford Motor, Seagate Technology, Sanmina-SCI, Battelle Memorial Institute, and National Institute of Standards and Technology. Read all about them and then cast your ballot. The winner will designate a $10,000 donation to an engineering school. Read More

Call for Nominations: T&MW Awards Program
Test & Measurement World is now accepting nominations for the 2009 Best in Test and Test of Time awards. Read More

New challenge questions for October
Answer a challenge question correctly, and you could be eligible to win a prize.

Oscilloscope Challenge:
Question: Which of the following is an oscilloscope display mode that can facilitate jitter measurements on high-speed serial data lines?
Prize: TomTom ONE GPS
Sponsor: Yokogawa

Data-Acquisition Challenge:
Question: What is the potential role of LXI in data-acquisition applications?
Prizes: Three $100 American Express gift cards (three winners of $100 each)
Sponsor: Data Translation

Go to the Challenge Page

Do you make enough money?
Read the results of our 2008 Salary Survey to learn whether your salary and benefits are competitive with those of your peers in the test-engineering industry. Read More

RF modules pose tough test challenges
Our October cover story explains how engineers at EPCOS employ multiport vector network analyzers to test multifunction miniature front-end modules that support multiple wireless communications standards. Another feature describes how manufacturers of transceivers, line cards, and components work together to create Small Form-Factor Pluggable products. And the Machine-Vision & Inspection Test Report describes a new SEM technology. Read More

Industry calendar of events
Upcoming events include the International Test Conference (October), Electronica (November), and Vision 2008 (November). For more information about these and other test-related events, visit our online calendar.

 

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