T&MW's Test Industry News

October 9, 2008

ITC panel to address yield learning: who pays, who gets the data
Conventional wisdom holds that the foundry is responsible for funding and managing the tools associated with semiconductor product quality, says Phil Burlison at Verigy, but new tools that convert test-failure data into meaningful indicators of design problems pose questions such as who pays for them, how is the data promulgated, and to whom?
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A D V E R T I S E M E N T

Develop High-Performance Parallel Test Systems with NI LabVIEW 8.6

Test devices up to 10X faster than traditional instrumentation with National Instruments LabVIEW software. LabVIEW improves test throughput by creating parallel test applications that exploit the performance of multicore systems. Test a wide range of wireless protocols standards including, WLAN, WiMAX, DVB-T, and GPS. View demos and evaluate LabVIEW.

Power-aware test hot at ITC, as is analog test
Power-aware test will be the focus of a panel discussion and two technical paper sessions at this year's International Test Conference, says program chair Nur Touba. Other hot topics include analog test, which will be addressed in an interactive talk with analog legend Bob Pease. Read More

Team Hyper begins its robotics season
Every Wednesday at Quincy High School's Center for Technical Education in Quincy, MA, students from the school and nearby North Quincy High School meet as Hyper Robotics Team 69. Team Hyper's name is an acronym for its purpose: helping youth pursue engineering and robotics. Read More

Test and generate DigRF signals
Mobile RF devices such as cell phones have an RFIC front end with a digital bus on the back end that connects to a broadband IC. That digital bus, known as DigRF, has recently been upgraded from version 3 to version 4. Read More

A D V E R T I S E M E N T

Free Agilent DC Power Supply Tips, Hints and Special Offers

Get the most out of your Agilent DC Power Product. Don't miss this series of tips designed to share hints based on real applications and test scenarios encountered by your peers. Click here for the fourth series of briefs, special offers and more.

Boundary-scan software platform automates complex cluster tests per IEEE 1445
The newly developed tools are based on IEEE 1445 DTIF (Digital Test Interchange Format) and enable the application of functional tests for boards and systems with an integrated boundary-scan architecture. Read More

Sundance debuts PXI Express DSP/FPGA platform
In conjunction with becoming a member of the PXI Systems Alliance, Sundance announced that it will be introducing a range of PXI Express products for DSP/FPGA multiprocessor systems. Read More

Data Translation offers OEM version of USB module
The DT9812 family of USB data-acquisition modules from Data Translation now includes an OEM version that allows users to embed the board into their own systems. Read More

A D V E R T I S E M E N T

Kikusui introduces new products at IEEE EMC 2008

New products line up Includes upgraded ESD gun (KES4022), Harmonic/Flicker Analyzer (KHA3000) and KES7822S, the new field decay which complies with not only ISO standard but major Japanese automaker's unique standards. Kikusui also exhibits new regenerative DC electronic load to demonstrate its efficiency. Click here

Call for Nominations: T&MW Awards Program
Test & Measurement World is now accepting nominations for the 2009 Best in Test and Test of Time awards. Read More

Vote for the 2009 Test Engineer of the Year
The six finalists work at St. Jude Medical, Ford Motor, Seagate Technology, Sanmina-SCI, Battelle Memorial Institute, and National Institute of Standards and Technology. Read all about them and then cast your ballot. The winner will designate a $10,000 donation to an engineering school. Read More

Take a challenge, win a prize
Answer a challenge question correctly, and you could be eligible to win a prize.

Oscilloscope Challenge:
Question: Which of the following is an oscilloscope display mode that can facilitate jitter measurements on high-speed serial data lines?
Prize: TomTom ONE GPS
Sponsor: Yokogawa

Data-Acquisition Challenge:
Question: What is the potential role of LXI in data-acquisition applications?
Prizes: Three $100 American Express gift cards (three winners of $100 each)
Sponsor: Data Translation

Go to the Challenge Page

October issue looks at RF modules, power-aware ATPG, and GigE Vision
Our October cover story describe how engineers at EPCOS employ multiport vector network analyzers to test multifunction miniature front-end modules that support multiple wireless communications standards. Another feature, "Playing it cool," explains how power-aware ATPG technology controls thermal and power-rail-droop problems. And the Machine-Vision & Inspection Test Report discusses the role of GigE Vision in inspection applications. Read More

Industry calendar of events
Upcoming events include the International Test Conference (October) and the Institute of Environmental Sciences and Technology Fall Conference (November). For more information about these and other test-related events, visit our online calendar.

 

A D V E R T I S E M E N T

Getting more value out of test - beyond pass/fail

The semiconductor industry faces a never-ending stream of challenges associated with yield ramp-up and product quality improvement. Test is no longer about pass/fail, it's now emerging as a critical technology for identifying systematic defect mechanisms. Learn how to leverage DFT based production test, to detect and correct design and process related yield problems. Download whitepaper



A D V E R T I S E M E N T


EDN announces annual Innovation Awards

EDN proudly announces its 19th annual Innovation Awards program. Nominate your company's engineers and products for recognition in this prestigious program. The deadline is November 26, 2008, so don't delay.

Go to the Innovation Awards page for more information



 

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