November 4, 2008

Goepel debuts I/O module, details new initiative with SPEA
At the International Test Conference, Goepel electronic introduced the SFX-9305 I/O module as a new addition to the ScanFlex hardware platform. It also announced extended JTAG functionality for the SPEA 4040 flying prober. Read More

A D V E R T I S E M E N T WEBCAST: Back-to-Basics: Measurement-Based Channel Modeling for Signal Integrity using Agilent ADS Watch a rapid technique “what if” analysis for signal integrity applications. Learn a much faster, more thorough approach to explore the design space than "iterating the hardware to success.” An ADS circuit model using a Tyco XAUI backplane is used in a series of simulations to show what configuration changes lead to the required performance. Register now!

Intellitech unveils Bluetooth-based JTAG pod
Intellitech has introduced its UltraTAP-BT, a Bluetooth-enabled IEEE 1149.1/JTAG pod with nonvolatile test program and failure memory. The UltraTAP-BT is designed to allow plug-and-play test and FPGA configuration without the need for a computer, cable, and software. Read More

Disciplines merge, but who pays?
This final "Design, Test & Yield" column of 2008 presents an opportunity to address the interactions of these three fields throughout the year and to suggest trends that will evolve in 2009. Read More

Quality by negotiation
For the past 25 years, engineers at Mercury Computer Systems have designed processor boards and systems for military applications, but yesterday's design and test methods no longer work. Read More

ATE companies team with chip makers, OSAT
Driven by economic forces, five ATE makers came together under the CAST banner in an effort to foster precompetitive collaboration. Representatives of the nine companies supporting the CAST initiative so far—Advantest, Amkor, Infineon, Intel, LTX-Credence, Qualcomm, Roos Instruments, Teradyne, and Verigy—took the stage at the International Test Conference to discuss their reasons for forming CAST, which stands for "Collaborative Alliance for Semiconductor Test." Read More

Best in Test Awards: Nomination deadline is tomorrow
Time is running out. Nominations for Test & Measurement World's 2009 Best in Test and Test of Time awards are due November 5. Submit your nomination today! Read More

A D V E R T I S E M E N T Get Competitive Bids on Industrial Purchases Compare prices for industrial and materials handling equipment, business services and more! Start saving today by getting FREE price quotes from BuyerZone - Where Smart Businesses Buy and Sell. Click here

JTAG Technologies, Teseda tout Teradyne initiatives
Representatives of JTAG Technologies and Teseda were on hand at the International Test Conference to describe separate initiatives in conjunction with Teradyne—involving TestStation boundary-scan integration and silicon debug, respectively. Read More

Cadence assists Hitachi with 300X compression, Moai with fast tapeout
Cadence said Hitachi has combined Encounter Test pattern-fault modeling with test pattern generation, compression, and diagnostics to produce LSI devices for telecommunications and other applications. Cadence also said that Moai Electronics has deployed Cadence Encounter RTL Compiler and Encounter Test to tape out a flash memory controller. Read More

Synopsys touts DFT MAX compression adoption at 90 nm
Synopsys has announced that its DFT MAX compression product has been successfully deployed at more than one hundred semiconductor companies, including Aquantia, Dongbu Hitek, Exar, Frontier Silicon, Imagination Technologies, Integrated Device Technology, ITT, LG Electronics, Manthan Semiconductors, Nuvoton Technology, NVIDIA, Realtek, Renesas Technology, Samsung, Toshiba, and TranSwitch. Read More

November challenges cover color and pull-up resistors
Answer a challenge question correctly, and you could be eligible to win a prize.

Oscilloscope Challenge:
Question: What is the order of the colors used to indicate the frequency of occurrence of a signal?
Prize: TomTom ONE GPS
Sponsor: Yokogawa

Data-Acquisition Challenge:
Question: Why do data-acquisition and control systems use a high-value pull-up resistor connected between a thermocouple and a fixed voltage?
Prizes: Two $100 AMEX gift cards (two winners of $100 each)
Sponsor: Test & Measurement World

Go to the Challenge Page

A D V E R T I S E M E N T EDN announces 19th Annual Innovation Awards EDN proudly announces its 19th Annual Innovation Awards program. Nominate your company's engineers and products today for recognition in this prestigious program. The deadline is November 26, 2008, so don't delay. Go to the Innovation Awards page for more information

Troubleshoot intermittent signals; compress digital signals
Our November issue is now online. One feature explains how to use a digital oscilloscope to locate an elusive waveform, set up a trigger, and capture the event. Another feature discusses digital signal compression in mixed-signal ATE, and the Machine-Vision Tech Trends column offers advice for planning a machine-vision system. Plus, the issue also includes the PXI Test Report. Read it today

Industry calendar of events
Upcoming events include the Measurement Science Conference (March) and APEX (March). For more information about these and other test-related events, visit our online calendar.

November Issue

S P O N S O R E D Read Finding Power/Ground Defects on Connectors by Agilent in the TMWorld.com Resource Center As printed circuit boards become faster, defects in connectors and sockets can have more subtle and damaging effects. This paper surveys existing tests for these defects and introduces a solution based on Network Parameter Measurements. Other Resource Center Features: • Simulating The Effects of a Transfer Switch by Pacific Power Source • Boundary-Scan for PCB Interconnect Testing by Corelis • Embedded System Design for Machine Control by National Instruments